Last week we saw news that the MediaTek Helio X25 is to be exclusive to Meizu, but benchmark results spotted in GFXBench website shows that it will be used in the upcoming LeTV LeEco Le2 too.
The Helio X20 chipset, in case you are not familiar, has a 10-core (‘deca-core’) CPU design – a big Cortex-A72 (2x) cluster, medium A53 cluster (4x) and a small A53 cluster (4x) each at different clock speeds (the A72s top out at 2GHz). A Mali-T880 GPU handles the graphics – same GPU as the Exynos 8890, but with 4 cores compared to 12 on the Exynos 8890.
Other specs gotten from the benchmark suggests that the phone will have a 5.5″ phablet with a 1080p screen, 3GB of RAM and 32GB storage and runs Android 6.0 Marshmallow.
The LeTV Le 2 boasts a 16MP camera with 4K video capture, plus an 8MP/1080p selfie camera. The phone should bring 4G LTE and dual-SIM connectivity, plus a USB Type-C port.
LeEco has scheduled an event for April 20, so it could be about a month before the phone is made official.